RF-Systems, Components and Interconnects

Die Gruppe RF Systems, Components and Interconnects am LHFT bündelt die Entwicklung und Charakterisierung von Hochfrequenzsystemen, Komponenten und Interconnects von MHz bis Sub-THz.

Advanced Module, Packaging and Antenna Development and Assembly

At LHFT, Advanced Module Packaging and Antenna Development and Assembly focuses on chip-to-chip interconnects, their package integration, and antenna and assembly solutions.

MISE

Modulare ISAC SDR Evaluationsplattform

In the MISE project, LHFT develops a compact, modular ISAC research platform based on RFSoC and interchangeable RF frontends for 6G communication, sensing, and real-time digital radar.

Open6GHub+

Within the 6G Platform Germany research consortium, research on the next generation of mobile communications, 6G, is being conducted at LHFT in the Project Open6GHub+. The chair’s activities focus on the development of a broadband massive MIMO testbed as well as on methods for the calibration of this system. In addition, the testbed is used to investigate the localization of objects, such as drones, by means of multistatic digital radar measurements.

RF-Systems

At LHFT, RF Systems focuses on the design, development, and characterization of high-frequency systems and assemblies for frequencies from a few MHz up to the sub-THz range.