Tobias Bader

2026

• Hahn L., Bürk L., Bader T., Panusch D., Carlowitz C., Gold G., Vossiek M.:
  Sub-THz Signal Distribution Based on Additively Manufactured Dielectric Image Lines
  In: IEEE Journal of Microwaves 6 (2026), p. 738-753
  ISSN: 2692-8388
  DOI: 10.1109/JMW.2026.3682062

2025

• Bader T., Gold G.:
  Analog Phase Shifter with Substrate Integrated Electrodes in Dielectric Image Line Technology
  55th European Microwave Conference, EuMC 2025 (Utrecht, NLD, 23. September 2025 - 25. September 2025)
  In: 2025 55th European Microwave Conference, EuMC 2025 2025
  DOI: 10.23919/EuMC65286.2025.11235133
• Hahn L., Bader T., Pfahler T., Gloßner M., Vossiek M.:
  An Additively Manufactured 300 GHz Dielectric Rod Antenna Packaging for Sub-THz Radar Camera Applications
  19th European Conference on Antennas and Propagation, EuCAP 2025 (Stockholm, SWE, 30. März 2025 - 4. April 2025)
  In: EuCAP 2025 - 19th European Conference on Antennas and Propagation 2025
  DOI: 10.23919/EuCAP63536.2025.10999946

2024

• Bader T., Gold G.:
  Additively Manufactured Leaky Wave Antenna in Dielectric Image Line Technology
  54th European Microwave Conference, EuMC 2024 (Paris, 24. September 2024 - 26. September 2024)
  In: 2024 54th European Microwave Conference, EuMC 2024 2024
  DOI: 10.23919/EuMC61614.2024.10732783
• Bader T., Gold G.:
  Towards Dielectric Chip-to-Chip Interconnects for THz Applications
  2024 IEEE Wireless and Microwave Technology Conference, WAMICON 2024 (Clearwater, FL, USA, 15. April 2024 - 16. April 2024)
  In: 2024 IEEE Wireless and Microwave Technology Conference, WAMICON 2024 2024
  DOI: 10.1109/WAMICON60123.2024.10522803
• Hahn L., Bader T., Carlowitz C., Vossiek M., Gold G.:
  Tight Non-Radiating Bends of 3D-Printed Dielectric Image Lines Based on Electromagnetic Bandgap Mirrors
  2024 IEEE Wireless and Microwave Technology Conference (WAMICON) (Clearwater, 15. April 2024 - 16. April 2024)
  In: 2024 IEEE Wireless and Microwave Technology Conference (WAMICON) 2024
  DOI: 10.1109/WAMICON60123.2024.10522856
• Hahn L., Pfahler T., Bader T., Gold G., Vossiek M., Carlowitz C.:
  3D-Printed Dielectric Image Lines Towards Chip-to-Chip Interconnects for subTHz-Applications
  2024 IEEE International Conference on Microwaves, Communications, Antennas, Biomedical Engineering and Electronic Systems, COMCAS 2024 (Tel Aviv, ISR, 9. Juli 2024 - 11. Juli 2024)
  In: 2024 IEEE International Conference on Microwaves, Communications, Antennas, Biomedical Engineering and Electronic Systems, COMCAS 2024 2024
  DOI: 10.1109/COMCAS58210.2024.10666228

2023

• Bader T., Lomakin K., Gold G.:
  Ultra Wideband Power Detector for W-Band Applications Using a Novel Additively Manufactured Wave Mode Transducer
  2023 IEEE Wireless and Microwave Technology Conference, WAMICON 2023
  DOI: 10.1109/WAMICON57636.2023.10124907
• Hofmann A., Lomakin K., Kleinlein M., Bader T., Sippel M., Gold G.:
  SLS-Printed E-Band Waveguides and the Impact of Surface Roughness
  European Microwave Conference (EuMC) (Berlin, 17. September 2023 - 22. September 2023)
• Wittmann A., Bader T., Alidoust Chamandani S., Hentschel O., Schmidt M., Gold G.:
  Feasibility of Manufacturing Dielectric Image Lines by Using Laser-Based Directed Energy Deposition of Polymers
  In: IEEE Access (2023)
  ISSN: 2169-3536
  DOI: 10.1109/ACCESS.2023.3325197
  URL: https://ieeexplore.ieee.org/document/10286514/keywords#keywords

2021

• Hubert F., Bader T., Wahl L., Hofmann A., Lomakin K., Sippel M., Travitzky N., Gold G.:
  Additive Manufactured Waveguide for E-Band Using Ceramic Materials
  In: Applied Sciences 12 (2021), Article No.: 212
  ISSN: 2076-3417
  DOI: 10.3390/app12010212
  URL: https://www.mdpi.com/2076-3417/12/1/212